2U passive LGA 1700 CPU heat sink with heat pipes
Product Basic Parameters
Part Number |
SD-1700-R27 |
Fin Thinckness |
0.4mm |
CPU Socket |
Intel LGA1700 |
Fin Gap |
2.0mm |
Heatsink Dimension |
90.0mm*90.0mm*65.0mm |
TDP |
180W |
Hole Distance |
78mm*78mm |
Material |
Aluminum fin+Copper base+Heat pipes |
High Thermal Performance
Broad compatibility
Cost-effective solution
Main functions at a glance
● Wide Compatibility: Specifically designed for the LGA 1700 socket, suitable for the latest Intel processors.
● 2U form factor: Ideal for rack servers and compact chassis.
● Passive cooling: No need for additional fans, reducing noise and power consumption.
● Cost-Efficient: Affordable solution with durable construction for long-lasting performance.
Our service
Our Certificates
fAQ
Yes, Sinda Thermal provide customization service to all customer;s needs with lower cost.
02. What's the MOQ for this heatsink?
We can quote base on different MOQ as per customer needs.
03. Do we still need to pay for the tooling cost for this standard parts?
The standard heatsink is developed by Sinda and sell to all customers, no tooling charge cost.
04. How long is the LT?
We have some finished good or raw material in stock , for sampledemand , we can finish in 1 week ,and 2-3 weeks for mass production.
05. Is it possible to have some design optimization on the heatsink if customer needs ?
Yes, Sinda Thermal provide customization service to all customer;s needs with lower cost.
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